Methods Of Forming Non-Volatile Memory Devices Including Dummy Word Lines

ABSTRACT

A non-volatile memory device may include a semiconductor substrate including an active region at a surface thereof, a first memory cell string on the active region, and a second memory cell string on the active region. The first memory cell string may include a first plurality of word lines crossing the active region between a first ground select line and a first string select line, and about a same first spacing may be provided between adjacent ones of the first plurality of word lines. The second memory cell string may include a second plurality of word lines crossing the active region between a second ground select line and a second string select line, and about the same first spacing may be provided between adjacent ones of the second plurality of word lines. Related methods are also discussed.

RELATED APPLICATIONS

This U.S. non-provisional patent application claims the benefit of priority as a divisional of U.S. application Ser. No. 111/729,169 filed Mar. 28, 2007, which claims the benefit of priority under 35 U.S.C. §119 of Korean Patent Application No. 10-2006-0065040, filed on Jul. 11, 2006. The disclosures of both of the above referenced applications are hereby incorporated herein by reference in their entireties.

FIELD OF THE INVENTION

The present invention generally relates to electronics, and more particularly, to electronic memory devices and related methods.

BACKGROUND

Non-volatile memory devices, such as flash memory devices, may be provided in a NOR-type configuration or a NAND-type configuration. By way of example, NOR-type flash memory devices may provide relatively fast random access, while NAND-type flash memory devices may provide relatively low cost and/or relatively high integration. NOR-type flash memory devices may thus be used for code memory storage, while NAND-type flash memory devices may be used for mass memory storage.

NAND-type nonvolatile semiconductor memory devices are discussed, for example, in U.S. Pat. No. 7,079,437 to Hasama et al. entitled “Nonvolatile Semiconductor Memory Device Having Configuration Of NAND Strings With Dummy Memory Cells Adjacent To Select Transistors.” More particularly, Hasama et al. discusses a nonvolatile semiconductor memory device having a plurality of electrically rewritable nonvolatile memory cells connected in series together. A select gate transistor is connected in series with the serial combination of memory cells, and the memory cell which is located adjacent to the select gate transistor is a dummy cell which is not used for data storage. During a data erase operation, a same bias voltage that that is applied to the other memory cells is also applied to the dummy cell.

Notwithstanding known nonvolatile memory devices, there continues to exist a need in the art for structures and methods providing more highly integrated memory devices.

SUMMARY

According to some embodiments of the present invention, a non-volatile memory device may include a semiconductor substrate including an active region at a surface thereof, and first and second memory cell strings on the active region. The first memory cell string may include a first plurality of word lines crossing the active region between a first ground select line and a first string select line, and about a same first spacing may be provided between adjacent ones of the first plurality of word lines. The second memory cell string may include a second plurality of word lines crossing the active region between a second ground select line and a second string select line, and about the same first spacing may be provided between adjacent ones of the second plurality of word lines. The first ground select line may be between the second ground select line and the first plurality of word lines, and the second ground select line may be between the first ground select line and the second plurality of word lines. Portions of the active region between the first and second ground select lines may be free of word lines, and a second spacing between the first and second ground select lines may be at least about 3 times greater than the first spacing.

The second spacing may be in the range of about 3 to 4 times greater than the first spacing. The second spacing may be more than 3 times greater than the first spacing, and more particularly, the second spacing may be at least about 4 times greater than the first spacing.

The first plurality of word lines may include an even number of memory cell word lines and a dummy word line between a first of the even number of memory cell word lines and the first ground select line. About the same first spacing may be provided between the ground select line and the dummy word line, and about the same first spacing may be provided between the dummy word line and the first of the even number of memory cell word lines. Moreover, about the same first spacing may be provided between a last of the even number of the memory cell word lines and the string select line.

The first plurality of word lines may include an even number of memory cell word lines and a dummy word line between a first of the even number of memory cell word lines and the first ground select line. About the same first spacing may be provided between the dummy word line and the first of the even number of memory cell word lines, and a third spacing may be provided between the ground select line and the dummy word line. Moreover, the third spacing may be greater than the first spacing and no greater than two times the first spacing, and more particularly, the third spacing may be in the range of about 1.5 times the first spacing to about 2 times the first spacing.

The first plurality of word lines may include an even number of memory cell word lines, and at least 3 times the first spacing may be provided between the ground select line and the first of the even number of memory cell word lines. About the first spacing may be provided between the last of the even number of memory cell word lines and the string select line, and portions of the active region between the ground select line and the first of the even number of memory cell word lines may be free of word lines.

Each memory cell of the first and second memory cell strings may include a charge storage layer between the respective word line and the active region, and a barrier insulating layer between the charge storage layer and the word line. Moreover, an arrangement of the first memory cell string may have mirror image symmetry relative to an arrangement of the second memory cell string.

According to other embodiments of the present invention, a non-volatile memory device may include a semiconductor substrate including an active region at a surface thereof, a ground select line crossing the active region, and a string select line crossing the active region and spaced apart from the ground select line. A plurality of memory cell word lines may cross the active region between the ground select line and the string select line, and about a same first spacing may be provided between adjacent ones of the plurality of word lines. A second spacing may be provided between a last of the plurality of memory cell word lines and the string select line, and the second spacing may be greater than the first spacing and no greater than two times the first spacing. A dummy word line may be between a first of the plurality of memory cell word lines and the first ground select line, and about the first spacing may be provided between the dummy word line and the first of the plurality of memory cell word lines. A third spacing may be provided between the ground select line and the dummy word line, and the third spacing may be greater than the first spacing and no greater than two times the first spacing. More particularly, the third spacing may be in the range of about 1.5 times the first spacing to about 2 times the first spacing.

The plurality of memory cell word lines may be a first plurality of memory cell word lines, and the non-volatile memory device may further include a second ground select line crossing the active region, a second string select line crossing the active region, and a second plurality of memory cell word lines. The first ground select line may be between the second ground select line and the first plurality of memory cell word lines, and the second string select line may be spaced apart from the second ground select line with the second ground select line between the second string select line and the first ground select line. The second plurality of memory cell word lines may be between the second ground select line and the second string select line. Moreover, portions of the active region between the first and second ground select lines may be free of word lines, and a second spacing between the first and second ground select lines may be at least about 3 times greater than the first spacing.

The second spacing may be in the range of about 3 to about 4 times greater than the first spacing. More particularly, the second spacing may be more than 3 times greater than the first spacing, and still more particularly, the second spacing may be at least about 4 times greater than the first spacing.

In addition, a plurality of charge storage layers may be provided with respective ones of the charge storage layers between each of the plurality of word lines and the active region, and a plurality of barrier insulating layers may be provided with respective ones of the barrier insulating layers between each of the plurality of word lines and the charge storage layers. Moreover, the plurality of memory cell word lines may include an even number of memory cell word lines.

According to some other embodiments of the present invention, a non-volatile memory device may include a semiconductor substrate including a active region at a surface thereof, a ground select line crossing the active region, a string select line crossing the active region, and a plurality of memory cell word lines crossing the active region. The string select line may be spaced apart from the ground select line, and the plurality of memory cell word lines may cross the active region between the ground select line and the string select line. About a same first spacing may be provided between adjacent ones of the plurality of word lines and between a last of the plurality of memory cell word lines and the string select line. A second spacing may be provided between the ground select line and a first of the plurality of memory cell word lines, and the second spacing may be at least three times greater than the first spacing. Moreover, portions of the active region between the ground select line and the first of the plurality of memory cell word lines may be free of word lines. More particularly, the second spacing may be about three times greater than the first spacing, and/or the second spacing may be no greater than 4 times the first spacing.

The plurality of memory cell word lines may be a first plurality of memory cell word lines, and the non-volatile memory device further include a second ground select line crossing the active region, a second string select line crossing the active region, and a second plurality of memory cell word lines crossing the active region. The first ground select line may be between the second ground select line and the first plurality of memory cell word lines, and the second string select line may be spaced apart from the second ground select line with the second ground select line between the second string select line and the first ground select line. The second plurality of memory cell word lines may be between the second ground select line and the second string select line. Moreover, portions of the active region between the first and second ground select lines may be free of word lines, and a second spacing between the first and second ground select lines may be at least about 3 times greater than the first spacing.

The second spacing may be in the range of about 3 to about 4 times greater than the first spacing, and more particularly, the second spacing may be about 3 times greater than the first spacing or at least about 4 times greater than the first spacing.

In addition, a plurality of charge storage layers may be provided with respective ones of the charge storage layers between each of the plurality of word lines and the active region, and a plurality of barrier insulating layers may be provided with respective ones of the barrier insulating layers between each of the plurality of word lines and the charge storage layers. Moreover, the plurality of memory cell word lines may include an even number of memory cell word lines.

According to still other embodiments of the present invention, a method of forming a non-volatile memory device may include forming an etch target layer on a substrate. First hard mask patterns may be formed including a plurality of odd word line patterns between first and second select line patterns, and about a same spacing may be provided between the first select line pattern and a first odd word line pattern, between adjacent odd word line patterns, and between a last odd word line pattern and the second select line pattern. Moreover, the first hard mask pattern may include a first material. A sacrificial mask layer may be formed on the first hard mask pattern with gaps remaining between portions of the sacrificial mask layer on sidewalls of adjacent ones of the odd word line patterns. The sacrificial mask layer may include a second material, and the first and second materials may have different compositions. Second hard mask patterns may be formed on the sacrificial mask layer, and the second hard mask patterns may include a dummy word line pattern between the first select line pattern and the first odd word line pattern. The second hard mask patterns may also include even word line patterns between adjacent odd word line patterns and between the last odd word line pattern and the second select line pattern. Moreover, the second hard mask pattern may include a third material, and the second and third materials may have different compositions. Portions of the sacrificial mask layer between the first and second hard mask patterns may be removed so that portions of the etch target layer are exposed between the first and second hard mask patterns, and portions of the etch target layer exposed between the first and second hard mask patterns may be etched.

The spacing provided between the first select line pattern and the first odd word line pattern may be about three times a width of the first odd word line pattern. Moreover, the first hard mask patterns may include silicon nitride, the sacrificial mask layer may include polysilicon, and the second hard mask patterns may include silicon oxide.

The odd word line patterns may have about a same width, and the spacing between adjacent ones of the plurality of the odd word line patterns may be greater than the width of the odd word line patterns. In addition, forming the etch target layer may include forming a charge storage layer on the substrate, forming a barrier insulating layer on the charge storage layer, and forming a control gate layer on the barrier insulating layer.

According to yet other embodiments of the present invention, a method of forming a non-volatile memory device may include forming an etch target layer on a substrate. First hard mask patterns may be formed on the substrate, and the first hard mask patterns may include a plurality of even word line patterns between first and second select line patterns and a dummy word line pattern between the first select line pattern and a first even word line pattern. About a same first spacing may be provided between the dummy word line pattern and the first even word line pattern and between adjacent even word line patterns, and a second spacing may be provided between the first select line pattern and the dummy word line pattern and between a last even word line pattern and the second select line pattern. Moreover, the second spacing may be less than the first spacing, and the first hard mask patterns may include a first material. A sacrificial mask layer may be formed on the first hard mask patterns with gaps remaining between portions of the sacrificial mask layer on sidewalls of adjacent ones of the even word line patterns and between the dummy word line pattern and the first even word line pattern. The sacrificial mask layer may include a second material, and the first and second materials may have different compositions. Second hard mask patterns may be formed in the gaps on the sacrificial layer, and the second hard mask patterns may include odd word line patterns between adjacent even word line patterns and between the dummy word line pattern and the first even word line pattern. The second hard mask patterns may include a third material, and the second and third materials may have different compositions. Portions of the sacrificial mask layer may be removed between the first and second hard mask patterns so that portions of the etch target layer are exposed between the first and second hard mask patterns, and a space between the dummy word line pattern and the first select line pattern may be free of any of the second hard mask patterns. Portions of the etch target layer exposed between the first and second hard mask patterns may then be etched.

The first spacing provided between the dummy word line pattern and a first even word line pattern and between adjacent even word line patterns may be about three times a width of the first even word line pattern. The second spacing may be greater than a width of the first even word line pattern and no greater than two times the width of the first even word line pattern. The second spacing may be in the range of about 1.5 times the width of the first even word line pattern to about 2 times the width of the first even word line pattern.

The even word line patterns may have about a same width, and the spacing between adjacent ones of the plurality of the even word line patterns may be greater than the width of the even word line patterns. In addition, forming the etch target layer may include forming a charge storage layer on the substrate, forming a barrier insulating layer on the charge storage layer, and forming a control gate layer on the barrier insulating layer.

A method of forming a non-volatile memory device may include forming an etch target layer on a substrate and forming first hard mask patterns on the substrate. The first hard mask patterns may include a plurality of odd word line patterns between first and second select line patterns, and about a same first spacing may be provided between adjacent odd word line patterns and between a last odd word line pattern and the second select line pattern. A second spacing may be provided between the first select line pattern and a first odd word line pattern, and the second spacing may be greater than the first spacing, and the first hard mask patterns may include a first material. A sacrificial mask layer may be formed on the first hard mask patterns with gaps remaining between portions of the sacrificial mask layer on sidewalls of adjacent first hard mask patterns, and the sacrificial mask layer may include a second material, the first and second materials having different compositions. Second hard mask patterns may be formed on the sacrificial layer, and the second hard mask patterns may include even word line patterns between adjacent odd word line patterns and between the last odd word line pattern and the second select line pattern. A space between the first select line pattern and the first odd word line pattern may be free of any of the second hard mask patterns, and the second hard mask patterns may include a third material with the second and third materials having different compositions. Portions of the sacrificial mask layer may be removed between the first and second hard mask patterns so that portions of the etch target layer are exposed between the first and second hard mask patterns. Portions of the etch target layer exposed between the first and second hard mask patterns may then be etched.

The same first spacing may be about three times a width of the first odd word line pattern. In addition, forming the etch target layer may include forming a charge storage layer on the substrate, forming a barrier insulating layer on the charge storage layer, and forming a control gate layer on the barrier insulating layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a plan view of a non-volatile memory device according to some embodiments of the present invention.

FIG. 1B is a cross-sectional view taken along line I-I′ of FIG. 1A.

FIG. 1C is an enlarged cross-sectional view illustrating ground induced leakage current during a programming operation.

FIG. 1D is an enlarged cross-sectional view illustrating coupling capacitance during an erase operation.

FIG. 2A is a plan view of a non-volatile memory device according to some embodiments of the present invention.

FIG. 2B is a cross-sectional view taken along section line II-II′ of FIG. 2A.

FIG. 3A is a plan view of a non-volatile memory device according to some other embodiments of the present invention.

FIG. 3B is a cross-sectional view taken along section line of FIG. 3A.

FIG. 4A is a plan view of a non-volatile memory device according to some other embodiments of the present invention.

FIG. 4B is a cross-sectional view taken along section line IV-IV′ of FIG. 4A.

FIGS. 5A-D are cross-sectional views illustrating operations of forming non-volatile memory structures of FIGS. 2A-B according to embodiments of the present invention.

FIGS. 6A-D are cross-sectional views illustrating operations of forming non-volatile memory structures of FIGS. 3A-B according to embodiments of the present invention.

FIGS. 7A-D are cross-sectional views illustrating operations of forming non-volatile memory structures of FIGS. 4A-B according to embodiments of the present invention.

DETAILED DESCRIPTION

The present invention is described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the present invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. Like numbers refer to like elements throughout.

It will be understood that when an element or layer is referred to as being “on”, “connected to” or “coupled to” another element or layer, it can be directly on, connected or coupled to the other element, or layer or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly connected to” or “directly coupled to” another element or layer, there are no intervening elements or layers present. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, third etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”, “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the exemplary term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. Also, as used herein, “lateral” refers to a direction that is substantially orthogonal to a vertical direction.

The terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting of the present invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

Example embodiments of the present invention are described herein with reference to cross-section illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of the invention. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, embodiments of the present invention should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an implanted region illustrated as a rectangle will, typically, have rounded or curved features and/or a gradient of implant concentration at its edges rather than a binary change from implanted to non-implanted region. Likewise, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation takes place. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the present invention.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Accordingly, these terms can include equivalent terms that are created after such time. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the present specification and in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. All publications, patent applications, patents, and other references mentioned herein are incorporated by reference in their entirety.

As shown in FIGS. 1A and 1B, a flash memory device may include a plurality of parallel active regions ACT in a semiconductor substrate separated by device isolation layers. In addition, ground select lines GSL, string select lines SSL, and word lines WL may cross the active regions ACT. More particularly, a respective charge storage gate may be provided between each word line WL and each active region ACT to provide a respective memory cell at each intersection of a word line WL and an active region ACT. Moreover, a plurality of memory cells along an active region ACT between a ground select line GSL and a string select line SSL may define a memory cell string. As further shown in FIGS. 1A and 1B, adjacent memory cell strings may be separated by two ground select lines GSL or by two string select lines SSL.

As shown in the enlarged cross-sectional views of FIGS. 1C and 1D, a gate insulating layer GIL may be provided between the ground select line GSL and the active region ACT of the semiconductor substrate SUB. In addition, a charge storage gate CSG may be provided between the word line WL1 and the active region ACT of the substrate SUB, a tunnel insulating layer TIL may be provided between the charge storage gate CSG and the active region ACT, and a barrier insulating layer BIL may be provided between the charge storage gate CSG and the word line WL1.

During a programming operation (for a memory cell other than that shown in FIG. 1C), 0 volts may be applied to the ground select line GSL and a pass voltage Vpass may be applied to the non-selected word line WL1 as shown in FIG. 1C. In addition, a program voltage Vpgm may be applied to a selected word line (not shown) corresponding to a memory cell(s) to be programmed. A gate voltage of the ground select transistor (defined by the ground select line GSL and the gate insulating layer GIL) may thus be 0 volts while a drain voltage of the ground select transistor may be about 10 volts resulting in a gate induced leakage current GIDL.

During an erase operation, the ground select line GSL may be allowed to float, and an erase voltage Vers of about 20 volts may be applied to a p-well of the substrate SUB, and 0 volt may be applied to the word line WL1, as shown in FIG. 1D. Accordingly, the erase voltage Vers of 20 volts applied to the p-well may boost a potential of the ground select line GSL, and a potential of the charge storage gate CSG (adjacent to the ground select line GSL) may increase due to capacitive coupling Cp between the ground select line GSL and the charge storage gate CSG. An undesirable erase disturbance may thus result at the charge storage gate CSG and/or the word line WL1.

FIG. 2A is a plan view of a non-volatile memory device 20 (such as a flash memory device) according to some embodiments of the present invention, and FIG. 2B is a cross-sectional view taken along section line II-II′ of FIG. 2A. The flash memory device 20 may include a plurality of parallel active regions ACT in a semiconductor substrate SUB separated by device isolation layers. In addition, ground select lines GSL₀₋₂, string select lines SSL₀₋₂, dummy word lines WL_(d), and memory cell word lines WL_(1-2n) (where n is an integer) may cross the active regions ACT. More particularly, a respective charge storage gate may be provided between each memory cell word line WL_(1-2n) and each active region ACT to provide a respective memory cell at each intersection of a memory cell word line WL_(1-2n) and an active region ACT. Similarly, a charge storage gate may be provided between each dummy word line WL_(d) and active region ACT so that the structures of the dummy word lines WL_(d) and the memory cell word lines WL_(1-2n) are the same.

An even number of memory cell word lines WL_(1-2n) along an active region ACT between a ground select line GSL and a string select line SSL (e.g., between GSL₁ and SSL₁) may define a memory cell string including an even number of memory cells. As further shown in FIGS. 2A-B, adjacent memory cell strings may be separated by two ground select lines GSL (e.g., GSL₀ and GSL₁) or by two string select lines SSL (e.g., SSL₁ and SSL₂). More particularly, 2^(k) (where k is a positive integer) memory cell word lines WL_(1-2n) may define a memory cell string including 2^(k) memory cells used to store data. The dummy word line WL_(d), however, is not used to store data.

Moreover, an order of memory cell word lines WL_(1-2n) and dummy word line WL_(d) of adjacent memory cell strings may have a mirror image symmetry. For example, an order of memory cell word lines WL_(1-2n) and dummy word line WL_(d) between ground select line GSL₀ and string select line SSL₀ may have mirror image symmetry relative to an order of memory cell word lines WL_(1-2n) and dummy word line WL_(d) between ground select line GSL₁ and string select line SSL₁. Similarly, an order of memory cell word lines WL_(1-2n) and dummy word line WL_(d) between ground select line GSL₁ and string select line SSL₁ may have mirror image symmetry relative to an order of memory cell word lines WL_(1-2n) and dummy word line WL_(d) between ground select line GSL₂ and string select line SSL₂.

By providing a dummy word line WL_(d) between a ground select line GSL and a first memory cell word line WL₁ of a memory cell string, a ground induced leakage current and/or an erase disturbance at the first memory cell word line WL₁ may be reduced. Moreover, a controller of the non-volatile memory device may be coupled to the ground select lines, the string select lines, the memory cell word lines, and the dummy word lines. During an erase operation, for example, the controller may be configured to allow the ground select line GSL₁ to float, to apply an erase voltage Vers of about 20 volts to a p-well of the substrate SUB, and to apply 0 volts to the memory cell word lines WL_(1-2n). In addition, the controller may be configured to apply a bias voltage Vb to the dummy word line WL_(d) with the bias voltage Vb being between a supply voltage Vcc and a pass voltage Vpass (i.e., Vcc<Vb<Vpass) to thereby reduce an erase disturbance at the first memory cell word line WL₁ and/or at respective charge storage layers.

During a write (or program) operation, the controller may be configured to apply the supply voltage Vcc to the ground select line GSL₁, to apply 0 volts to a p-well of the substrate SUB, to apply a pass voltage Vpass to the non-selected word lines, and to apply a program voltage Vpgm to the selected word line. In addition, the controller may be configured to apply a bias voltage Vb to the dummy word line WL_(d) with the bias voltage Vb being between the supply voltage Vcc and the pass voltage Vpass (i.e., Vcc<Vb<Vpass) to thereby reduce ground induced leakage current at the ground select line adjacent to the dummy word line.

As shown in FIGS. 2A-B, the dummy word line WL_(d) and each of the memory cell word lines WL₁ to WL_(2n) may have about a same width F₁. In addition, about a same width/spacing W₁ may separate a gate selection line GSL and an adjacent dummy word line WL_(d), about the same width/spacing W₁ may separate a dummy word line WL_(d) and an adjacent first memory cell word line WL₁, about the same width/spacing W₁ may separate adjacent memory cell word lines WL_(x) and WL_(x+1), and about the same width/spacing W₁ may separate a last memory cell word line WL_(2n) and an adjacent string select line SSL. Moreover, the widths F₁ and W₁ may be about the same, and more particularly, each of the widths F₁ and W₁ may be about one fourth (¼) of a period P₁ defined by adjacent even memory cell word lines WL_(even) and WL_(even+2) (i.e., even memory cell word lines separated by only one odd memory cell word line), or defined by adjacent odd memory cell word lines WL_(odd) and WL_(odd+2) (i.e., odd memory cell word lines separated by only one even memory cell word line). As further shown in FIGS. 2A-B, adjacent ground selection lines GSL₀ and GSL₁ may be separated by about a width/spacing W₂, and adjacent string selection lines SSL₀ and SSL₁ may be separated by about the same width/spacing W₂. The width/spacing W₂ may be at least about 3 times greater than the width/spacing W₁.

Each memory cell word line WL₁ to WL_(2n) may thus provide a respective control electrode for a non-volatile memory cell (such as a flash memory cell) of a memory cell string on a same active region ACT between a ground select line (e.g., GSL₁) and a string select line (e.g., SSL₁). Each non-volatile memory cell may also include a charge storage layer between the respective memory cell word line and active region, a tunnel insulating layer between the active region and the charge storage layer, and a barrier insulating layer between the memory cell word line and the charge storage layer.

Each dummy word line WL_(d) may have a structure the same as that discussed above with respect to the memory cell word lines (with a tunnel insulating layer, a charge storage layer, and a barrier insulating layer between each dummy word line and respective active regions). The dummy cell word lines (and associated tunnel insulating layers, charge storage layers, and barrier insulating layers), however, are not used to store data, but are instead provided to reduce ground induced leakage current at the adjacent ground select line during programming operations and/or to reduce erase bias at the adjacent memory cell during erase operations.

The pattern of ground select lines GSL, dummy word lines WL_(d), memory cell word lines WL₁ to WL_(2n), and string select lines SSL may be formed using self-aligned double patterning as discussed in greater detail below. For example, the ground select lines GSL, the string select lines SSL, and the odd memory cell word lines (WL₁, WL₃, WL₅ . . . WL_(2n−1)) may be formed corresponding to a pattern of a photolithography mask, and the dummy word lines WL_(d) and the even memory cell word lines (WL₂, WL₄, WL₆ . . . WL_(2n)) may be formed using self-aligned double patterning.

According to some embodiments of the present invention illustrated in FIGS. 2A-B, a first memory cell string on the active region ACT may include a first plurality of memory cell word lines WL₁ to WL_(2n) crossing the active region ACT between the first ground select line GSL₁ and the first string select line SSL₁, and about a same first spacing W₁ may be provided between adjacent ones of the first plurality of word lines. In addition, a second memory cell string on the active region ACT may include a second plurality of word lines WL₁ to WL_(2n) crossing the active region ACT between a second ground select line GSL₀ and a second string select line SSL₁, and about the same first spacing W₁ may be provided between adjacent ones of the second plurality of word lines. More particularly, the first ground select line GSL₁ may be between the second ground select line GSL₀ and the first plurality of word lines, and the second ground select line GSL₀ may be between the first ground select line GSL₁ and the second plurality of word lines. Moreover, portions of the active region ACT between the first and second ground select lines GSL₁ and GSL₀ may be free of word lines, and the second spacing W₂ between the first and second ground select lines GSL₁ and GSL₀ may be at least about 3 times greater than the first spacing W₁. For example, the second spacing W₂ may be between about 3 and 4 times greater than the first spacing W₁, and more particularly, the second spacing W₂ may be more than 3 times greater than the first spacing W₁, and still more particularly, more than 4 times greater than the first spacing W₁.

In addition, the dummy word line WL_(d) may be provided between the first memory cell word line WL₁ and the first ground select line GSL₁, and about the same first spacing W₁ may be provided between the first ground select line GSL₁ and the dummy word line WL_(d). About the same first spacing W₁ may also be provided between the dummy word line WL_(d) and the first memory cell word line WL₁, and between the last memory cell word line WL_(2n−1) and the string select line SSL₁.

FIGS. 5A-D are cross-sectional views illustrating operations of forming the non-volatile memory structures of FIGS. 2A-B using self-aligned double patterning according to some embodiments of the present invention. As shown in FIG. 5A, a substrate 50 may include an etch target layer 52 thereon, and the etch target layer 52 may include layers of materials used to form the memory cells, word lines, selection transistors, and selection lines of FIGS. 2A-B.

More particularly, the target layer may include a tunnel insulating layer (such as a layer of silicon oxide), a charge storage gate layer (such as a layer of polysilicon or silicon nitride), a barrier insulating layer (such as a layer of silicon oxide or other dielectric material different than the charge storage gate layer), and conductive layer (such as a layer of polysilicon and/or metal). The charge storage layer may be between the conductive layer and the substrate with the tunnel insulating layer separating the charge storage layer and the substrate and with the barrier insulating layer separating the charge storage layer and the conductive layer. In addition, a first hard mask layer 55 may be formed on the etch target layer 52, and the first hard mask layer 55 may include a silicon nitride layer 56 on a pad oxide layer 54.

A photoresist layer on the first hard mask layer 55 may be patterned using the photo-mask 100 to provide the photoresist pattern 58 including odd word line photoresist patterns 58 w, ground select line photoresist patterns 58 g, and string select line photoresist patterns 58 s. More particularly, the photo-mask 100 may include a photo-mask pattern 104 on a transparent substrate 102. The photo-mask pattern 104 may include odd word line photo-mask patterns 104 w corresponding to odd word line photoresist patterns 58 w, ground select line photo-mask patterns 104 g corresponding to ground select line photoresist patterns 58 g, and string select line photo-mask patterns 104 s corresponding to string select line photoresist patterns 58 s.

As further shown in FIG. 5A, adjacent odd word line photo-mask patterns 104 w may be spaced apart by about a width/spacing W₁₁, and adjacent odd word line photoresist patterns 58 w may be spaced apart by about the width/spacing W₁₁. A first of the odd word line photo-mask patterns 104 w may be spaced apart from an adjacent ground select line photo-mask pattern 104 g by about the width/spacing W₁₁, and a last of the odd word line photo-mask patterns 104 w may be spaced apart from an adjacent string select line photo-mask pattern 104 s by about the width/spacing Similarly, a first of the odd word line photoresist patterns 58 w may be spaced apart from an adjacent ground select line photoresist pattern 58 g by about the width/spacing W₁₁, and a last of the odd word line photo-mask patterns 58 w may be spaced apart from an adjacent string select line photo-mask pattern 58 s by about the width/spacing W₁₁.

Moreover, each of the odd word line photo-mask patterns 104 w and each of the odd word line photoresist patterns 58 w may have a width of about F₁, and the width/spacing W₁₁ may be about three times the width F₁. In addition, adjacent ones of the odd word line photo-mask patterns 104 w and adjacent ones of the odd word line photoresist patterns 58 w may define a period P₁, and the period P₁ may be about 4 times the width F₁. The width F₁ may be a minimum feature size available from the photolithography technology being used. Adjacent ground select line photo-mask patterns 104 g, adjacent string select line photo-mask patterns 104 s, adjacent ground select line photoresist patterns 58 g, and adjacent string select line photoresist patterns 58 s may be separated by a width/spacing W₂, and the width/spacing W₂ may be greater than four times the width F₁. Moreover, the second spacing W₂ may be at least about 3 times greater than the first spacing W₁. For example, the second spacing W₂ may be between about 3 and 4 times greater than the first spacing W₁, and more particularly, the second spacing W₂ may be more than 3 times greater than the first spacing W₁, and still more particularly, more than 4 times greater than the first spacing W₁.

More particularly, a continuous photoresist layer may be selectively exposed to radiation through the photomask 100 and then developed to provide the photoresist pattern 58 of FIG. 5A. Accordingly, an arrangement of the photoresist pattern 58 is defined by an arrangement of the photo-mask pattern 104. In addition, the photoresist pattern 58 corresponds to a pattern of gate select lines, string select lines, and odd word lines discussed above with respect to FIGS. 2A-B.

Portions of the first hard mask layer 55 (including silicon nitride layer 56 and pad oxide layer 54) exposed by the photoresist pattern 58 may be selectively removed (for example, using dry etching) to provide a first hard mask pattern 60 (including ground select line hard mask patterns 60 g, string select line hard mask patterns 60 s, and odd word line hard mask patterns 60 w) as shown in FIG. 5B. If the first hard mask layer 55 includes separate layers 54 and 56, each element of the first hard mask pattern 60 may also include separate layers 54 and 56. About a same spacing/width W₁₁ may be provided between a ground select line hard mask pattern 60 g and a first odd word line hard mask pattern 60 w, between adjacent odd word line hard mask patterns 60 w, and between a, last odd word line hard mask pattern 60 w and a string select line hard mask pattern 60 s. Each element of the first hard mask pattern 60 may include a layer of silicon nitride and/or silicon oxide. After selectively removing portions of the first hard mask layer, the photoresist pattern 58 may be removed.

As further shown in FIG. 5B, a sacrificial mask layer 62 may be formed on the first hard mask pattern 60 and on portions of the etch target layer 52 exposed by the first hard mask pattern 60, and the sacrificial mask layer 62 and the first hard mask pattern 60 may comprise different materials. For example, upper layers 56 of the first hard mask pattern 60 may be a layer of silicon nitride, and the sacrificial mask layer 62 may be a layer of polysilicon. Moreover, a thickness of the sacrificial mask layer 62 may be provided so that: gaps remain between portions of the sacrificial mask layer 62 on sidewalls of adjacent ones of the odd word line hard mask patterns 60 w; gaps remain between portions of the sacrificial mask layer 62 on sidewalls of adjacent ground select line hard mask patterns 60 g; gaps remain between portions of the sacrificial mask layer 62 on sidewalls of adjacent string select line hard mask patterns 60 s; gaps remain between portions of the sacrificial mask layer 62 on sidewalls of adjacent select line hard mask patterns 60 g and first odd word line hard mask patterns 60 w; and gaps remain between portions of the sacrificial mask layer 62 on sidewalls of adjacent select line hard mask patterns 60 s and last odd word line hard mask patterns 60 w.

A thickness of the sacrificial mask layer 62 on sidewalls of the first hard mask patterns 60 w, 60 g, and 60 s may be about the same as the width/spacing W₁ between adjacent word lines WL_(x) and WL_(x+1) shown in FIGS. 2A-B. A width/spacing of a gap remaining between portions of the sacrificial mask layer 62 on adjacent odd word line mask patterns 60W may be about the same as a width F₁ of an even word line WL₂, WL₄, . . . WL_(2n) shown in FIGS. 2A-B.

After forming the sacrificial mask layer 62, a second hard mask layer 64 may be formed on the sacrificial mask layer 62, as further shown in FIG. 5B. Moreover, the second hard mask layer 64 may be a layer of silicon oxide, and the second hard mask layer 64 may have a thickness that is at least one half of the width F₁ to thereby fill gaps in the sacrificial mask layer 62 between odd word line hard mask patterns 60 w. Because wider gaps are provided between adjacent ground select line hard mask patterns 60 g and between adjacent string select line hard mask patterns 60 s, however, gaps 68 may remain in the second hard mask layer 64. If a thickness of the second hard mask layer 64 is about the width F₁ of a word line, adjacent ground select line patterns 60 g and adjacent string select line patterns 60 s may be separated by a width/spacing greater than four times F₁.

The second hard mask layer 64 may then be subjected to an etch back operation to remove portions of the hard mask layer 64 from between adjacent ground select line hard mask patterns 60 g, from between adjacent string select line hard mask patterns 60 s, and from upper surfaces of the sacrificial mask layer 62, as shown in FIG. 5C. Portions of the second hard mask layer 64 remaining after the etch back operation may thus have about the thickness F₁. More particularly, portions of the second hard mask layer 64 remaining after the etch back operation may define a second hard mask pattern 70 on the sacrificial mask layer 62. The second hard mask pattern 70 may include a dummy word line pattern 70 d between the ground select line pattern 60 g and the first odd word line pattern 60 w, and even word line patterns 70 w between adjacent odd word line patterns 60 w and between the last odd word line pattern 60 w and the string select line pattern 60 s.

Exposed portions of the sacrificial mask layer 62 may then be removed (for example, using a dry etch) as shown in FIG. 5D to expose portions of the etch target layer 52 not covered by the first and/or second hard mask patterns 60 and/or 70. Exposed portions of the etch target layer 52 may then be removed (for example, using a dry etch) using the first and second hard mask patterns 60 and 70 as an etch mask, and the first and second hard mask patterns 60 and 70 may then be removed to provide the structure of FIGS. 2A-B.

FIG. 3A is a plan view of a non-volatile memory device 30 (such as a flash memory device) according to some embodiments of the present invention, and FIG. 3B is a cross-sectional view taken along section line II-II′ of FIG. 3A. The flash memory device 30 may include a plurality of parallel active regions ACT in a semiconductor substrate SUB separated by device isolation layers. In addition, ground select lines GSL₀₋₂, string select lines SSL₀₋₂, dummy word lines WL_(d), and memory cell word lines WL_(1-2n) (where n is an integer) may cross the active regions ACT. More particularly, a respective charge storage gate may be provided between each memory cell word line WL_(1-2n) and each active region ACT to provide a respective memory cell at each intersection of a memory cell word line WL_(1-2n) and an active region ACT. Similarly, a charge storage gate may be provided between each dummy word line WL_(d) and active region ACT so that the structures of the dummy word lines WL_(d) and the memory cell word lines WL_(1-2n) are the same.

An even number of memory cell word lines WL_(1-2n) along an active region ACT between a ground select line GSL and a string select line SSL (e.g., between GSL₁ and SSL₁) may define a memory cell string including an even number of memory cells. As further shown in FIGS. 3A-B, adjacent memory cell strings may be separated by two ground select lines GSL (e.g., GSL₀ and GSL₁) or by two string select lines SSL (e.g., SSL₁ and SSL₂). More particularly, 2^(k) (where k is a positive integer) memory cell word lines WL_(1-2n) may define a memory cell string including 2^(k) memory cells used to store data. The dummy word line WL_(d), however, is not used to store data.

Moreover, an order of memory cell word lines WL_(1-2n) and dummy word line WL_(d) of adjacent memory cell strings may have a mirror image symmetry. For example, an order of memory cell word lines WL_(1-2n) and dummy word line WL_(d) between ground select line GSL₀ and string select line SSL₀ may have mirror image symmetry relative to an order of memory cell word lines WL_(1-2n) and dummy word line WL_(d) between ground select line GSL₁ and string select line SSL₁. Similarly, an order of memory cell word lines WL_(1-2n) and dummy word line WL_(d) between ground select line GSL₁ and string select line SSL₁ may have mirror image symmetry relative to an order of memory cell word lines WL_(1-2n) and dummy word line WL_(d) between ground select line GSL₂ and string select line SSL₂.

By providing a dummy word line WL_(d) between a ground select line GSL and a first memory cell word line WL₁ of a memory cell string, a ground induced leakage current and/or an erase disturbance at the first memory cell word line WL₁ may be reduced. Moreover, a controller of the non-volatile memory device may be coupled to the ground select lines, the string select lines, the memory cell word lines, and the dummy word lines. During an erase operation, for example, the controller may be configured to allow the ground select line GSL₁ to float, to apply an erase voltage Vers of about 20 volts to a p-well of the substrate SUB, and to apply 0 volts to the memory cell word lines WL_(1-2n). In addition, the controller may be configured to apply a bias voltage Vb to the dummy word line WL_(d) with the bias voltage Vb being between a supply voltage Vcc and a pass voltage Vpass (i.e., Vcc<Vb<Vpass) to thereby reduce an erase disturbance at the first memory cell word line WL₁ and/or at respective charge storage layers.

During a write (or program) operation, the controller may be configured to apply the supply voltage Vcc to the ground select line GSL₁, to apply 0 volts to a p-well of the substrate SUB, to apply a pass voltage Vpass to the non-selected word lines, and to apply a program voltage Vpgm to the selected word line. In addition, the controller may be configured to apply a bias voltage Vb to the dummy word line WL_(d) with the bias voltage Vb being between the supply voltage Vcc and the pass voltage Vpass (i.e., Vcc<Vb<Vpass) to thereby reduce ground induced leakage current at the ground select line adjacent to the dummy word line.

As shown in FIGS. 3A-B, the dummy word line WL_(d) and each of the memory cell word lines WL₁ to WL_(2n) may have about a same width F₁. In addition, about a same width/spacing W₁ may separate a dummy word line WL_(d) and an adjacent first memory cell word line WL₁, and about the same width/spacing W₁ may separate adjacent memory cell word lines WL_(x) and WL_(x+1). Moreover, the widths F₁ and W₁ may be about the same, and more particularly, each of the widths F₁ and W₁ may be about one fourth (¼) of a period P₁ defined by adjacent even memory cell word lines WL_(even) and WL_(even+2) (i.e., even memory cell word lines separated by only one odd memory cell word line), or defined by adjacent odd memory cell word lines WL_(odd) and WL_(odd+2) (i.e., odd memory cell word lines separated by only one even memory cell word line).

As further shown in FIGS. 3A-B, adjacent ground selection lines GSL₀ and GSL₁ may be separated by about a width/spacing W₂, and adjacent string selection lines SSL₀ and SSL₁ may be separated by about the same width/spacing W₂. Moreover, the second width/spacing W₂ may be at least about 3 times greater than the first spacing W₁. For example, the second spacing W₂ may be between about 3 and 4 times greater than the first spacing W₁, and more particularly, the second spacing W₂ may be more than 3 times greater than the first spacing W₁, and still more particularly, more than 4 times greater than the first spacing W₁. Furthermore, a width/spacing W₃ may separate a gate selection line GSL and an adjacent dummy word line WL_(d), and about the same width/spacing W₃ may separate a last memory cell word line WL_(2n) and an adjacent string select line SSL. The width/spacing W₃ may be greater than the width/spacing W₁, and more particularly, the width/spacing W₃ may be greater than the width/spacing W₁ and less than two times W₁ (i.e., W₁<W₃<2X W₁), and still more particularly, the width/spacing W₃ may be greater than 1.5 times the width/spacing W₁ and less than two times W₁ (i.e., 1.5XW₁<W₃<2XW₁).

Each memory cell word line WL₁ to WL_(2n) may thus provide a respective control electrode for a non-volatile memory cell (such as a flash memory cell) of a memory cell string on a same active region ACT between a ground select line (e.g., GSL₁) and a string select line (e.g., SSL₁). Each non-volatile memory cell may also include a charge storage layer between the respective memory cell word line and active region, a tunnel insulating layer between the active region and the charge storage layer, and a barrier insulating layer between the memory cell word line and the charge storage layer.

Each dummy word line WL_(d) may have a structure the same as that discussed above with respect to the memory cell word lines (with a tunnel insulating layer, a charge storage layer, and a barrier insulating layer between each dummy word line and respective active regions). The dummy cell word lines (and associated tunnel insulating layers, charge storage layers, and barrier insulating layers), however, are not used to store data, but are instead provided to reduce ground induced leakage current at the adjacent ground select line during programming operations and/or to reduce erase bias at the adjacent memory cell during erase operations.

The pattern of ground select lines GSL, dummy word lines WL_(d), memory cell word lines WL₁ to WL_(2n), and string select lines SSL may be formed using self-aligned double patterning as discussed in greater detail below. For example, the ground select lines GSL, the string select lines SSL, the dummy word lines WL_(d), and the even memory cell word lines (WL₂, WL₄, WL₆ . . . WL_(2n)) may be formed corresponding to a pattern of a photolithography mask, and the odd memory cell word lines (WL₁, WL₃, WL₅ . . . WL_(2n−1)) may be formed using self-aligned double patterning.

According to some embodiments of the present invention illustrated in FIGS. 3A-B, a first memory cell string on an active region ACT may include a first plurality of word lines WL₁ to WL_(2n) crossing the active region ACT between a first ground select line GSL₁ and a first string select line SSL₁, and about a same first spacing W₁ may be provided between adjacent ones of the first plurality of word lines WL₁ to WL_(2n). A second memory cell string on the active region ACT may include a second plurality of word lines WL₁ to WL_(2n) crossing the active region ACT between a second ground select line GSL₀ and a second string select line SSL₀, and about the same first spacing W₁ may be provided between adjacent ones of the second plurality of word lines WL₁ to WL_(2n). The first ground select line GSL₁ may be between the second ground select line GSL₀ and the first plurality of word lines, and the second ground select line GSL₀ may be between the first ground select line GSL₁ and the second plurality of word lines. Moreover, portions of the active region ACT between the first and second ground select lines GSL₁ and GSL₀ may be free of word lines, and a second spacing W₂ between the first and second ground select lines GSL₁ and GSL₀ may be at least about 3 times greater than the first spacing W₁. For example, the second spacing W₂ may be between about 3 and 4 times greater than the first spacing W₁, and more particularly, the second spacing W₂ may be more than 3 times greater than the first spacing W₁, and still more particularly, more than 4 times greater than the first spacing W₁.

In addition, the first plurality of word lines WL₁ to WL_(2n) may include an even number of memory cell word lines, and a dummy word line WL_(d) may be provided between a first of the memory cell word lines WL₁ to WL₂, and the ground select line GSL₁. About the same first spacing W₁ may be provided between the dummy word line WL_(d) and the first of the memory cell word lines WL₁ to WL_(2n). Moreover, a third spacing W₃ may be provided between the ground select line GSL₁ and the dummy word line WL_(d), and the third spacing W₃ may be greater than the first spacing W₁ and no greater than two times the first spacing W₁ (i.e., W₁<W₃<2X W₁).

FIGS. 6A-D are cross-sectional views illustrating operations of forming the non-volatile memory structures of FIGS. 3A-B using self-aligned double patterning according to some embodiments of the present invention. As shown in FIG. 6A, a substrate 150 may include an etch target layer 152 thereon, and the etch target layer 152 may include layers of materials used to form the memory cells, word lines, selection transistors, and selection lines of FIGS. 3A-B.

More particularly, the etch target layer 152 may include a tunnel insulating layer (such as a layer of silicon oxide), a charge storage gate layer (such as a layer of polysilicon or silicon nitride), a barrier insulating layer (such as a layer of silicon oxide or other dielectric material different than the charge storage gate layer), and conductive layer (such as a layer of polysilicon and/or metal). The charge storage layer may be between the conductive layer and the substrate with the tunnel insulating layer separating the charge storage layer and the substrate and with the barrier insulating layer separating the charge storage layer and the conductive layer. In addition, a first hard mask layer 155 may be formed on the etch target layer 152, and the first hard mask layer 155 may include a silicon nitride layer 156 on a pad oxide layer 154.

A photoresist layer on the first hard mask layer 155 may be patterned using the photo-mask 200 to provide the photoresist pattern 158 including dummy word line photoresist pattern 158 d, even word line photoresist patterns 158 w, ground select line photoresist patterns 158 g, and string select line photoresist patterns 158 s. More particularly, the photo-mask 200 may include a photo-mask pattern 204 on a transparent substrate 202. The photo-mask pattern 204 may include dummy word line photo-mask patterns 204 d corresponding to dummy word line photoresist patterns 158 d, even word line photo-mask patterns 204 w corresponding to even word line photoresist patterns 158 w, ground select line photo-mask patterns 204 g corresponding to ground select line photoresist patterns 158 g, and string select line photo-mask patterns 204 s corresponding to string select line photoresist patterns 158 s.

As further shown in FIG. 6A, adjacent even word line photo-mask patterns 204 w may be spaced apart by about a width/spacing W₁₁, and adjacent even word line photoresist patterns 158 w may be spaced apart by about the width/spacing W₁₁. A first of the even word line photo-mask patterns 204 w may be spaced apart from an adjacent dummy word line photo-mask pattern 204 d by about the width/spacing W₁₁, and a first of the even word line photoresist patterns 158 w may be spaced apart from an adjacent dummy word line photoresist pattern 158 d by about the width/spacing W₁₁. A dummy word line photo-mask pattern 204 d may be spaced apart from an adjacent ground select line photo-mask pattern 204 g by about the width/spacing W₃, and a last of the even word line photo-mask patterns 204 w may be spaced apart from an adjacent string select line photo-mask pattern 204 s by about the width/spacing W₃. Similarly, a dummy word line photoresist pattern 158 d may be spaced apart from an adjacent ground select line photoresist pattern 158 g by about the width/spacing W₃, and a last of the even word line photo-mask patterns 158 w may be spaced apart from an adjacent string select line photo-mask pattern 158 s by about the width/spacing W₃.

Moreover, each of the even word line photo-mask patterns 204 w and each of the even word line photoresist patterns 158 w may have a width of about F₁, and the width/spacing W₃ may be in the range of at least about the with F₁ to no greater than about two times the width F₁ (F₁#W₃#2X F₁). In addition, adjacent ones of the even word line photo-mask patterns 204 w and adjacent ones of the even word line photoresist patterns 158 w may define a period P₁, and the period P₁ may be about 4 times the width F₁. The width F₁ may be a minimum feature size available from the photolithography technology being used. Adjacent ground select line photo-mask patterns 204 g, adjacent string select line photo-mask patterns 204 s, adjacent ground select line photoresist patterns 158 g, and adjacent string select line photoresist patterns 158 s may be separated by a width/spacing W₂, and the width/spacing W₂ may be greater than three times the width F₁. For example, the second spacing W₂ may be between about 3 and 4 times greater than the first spacing W₁, or the second spacing W₂ may be more than 3 times greater than the first spacing W₁, and still more particularly, more than 4 times greater than the first spacing W₁.

More particularly, a continuous photoresist layer may be selectively exposed to radiation through the photomask 200 and then developed to provide the photoresist pattern 158 of FIG. 6A. Accordingly, an arrangement of the photoresist pattern 158 is defined by an arrangement of the photo-mask pattern 204. In addition, the photoresist pattern 158 corresponds to a pattern of gate select lines, string select lines, and even word lines discussed above with respect to FIGS. 3A-B.

Portions of the first hard mask layer 155 (including silicon nitride layer 156 and pad oxide layer 154) exposed by the photoresist pattern 158 may be selectively removed (for example, using dry etching) to provide a first hard mask pattern 160 (including ground select line hard mask patterns 160 g, string select line hard mask patterns 160 s, dummy word line hard mask pattern 160 d, and even word line hard mask patterns 160 w) as shown in FIG. 6B. If the first hard mask layer 155 includes separate layers 154 and 156, each element of the first hard mask pattern 160 may also include separate layers 154 and 156. About a same spacing/width W₁₁ may be provided between a dummy word line hard mask pattern 160 d and a first even word line hard mask pattern 160 w, and between adjacent even word line hard mask patterns 160 w. About the same spacing/width W₃ may be provided between a ground select line hard mask pattern 160 g and a dummy word line hard mask pattern 160 d, and between a last even word line hard mask pattern 160 w and a string select line hard mask pattern 160 s. Each element of the first hard mask pattern 160 may include a layer of silicon nitride and/or silicon oxide. After selectively removing portions of the first hard mask layer, the photoresist pattern 158 may be removed.

As further shown in FIG. 6B, a sacrificial mask layer 162 may be formed on the first hard mask pattern 160 and on portions of the etch target layer 152 exposed by the first hard mask pattern 160, and the sacrificial mask layer 162 and the first hard mask pattern 160 may comprise different materials. For example, upper layers 156 of the first hard mask pattern 160 may be a layer of silicon nitride, and the sacrificial mask layer 162 may be a layer of polysilicon. Moreover, a thickness of the sacrificial mask layer 162 may be provided so that: gaps remain between portions of the sacrificial mask layer 162 on sidewalls of adjacent ones of the even word line hard mask patterns 160 w; gaps remain between portions of the sacrificial mask layer 162 on sidewalls of adjacent ground select line hard mask patterns 160 g; gaps remain between portions of the sacrificial mask layer 162 on sidewalls of adjacent string select line hard mask patterns 160 s; and gaps remain between portions of the sacrificial mask layer 162 on sidewalls of adjacent dummy word line hard mask patterns 160 d and first even word line hard mask patterns 160 w. The sacrificial mask layer 162, however, may fill gaps between ground select line hard mask patterns 160 g and dummy word line hard mask patterns 160 c 1, and the sacrificial layer 162 may fill gaps between a last of the even word line hard mask pattern 160 w and adjacent string select line hard mask pattern 160 s.

A thickness of the sacrificial mask layer 162 on sidewalls of the first hard mask patterns 160 d, 160 w, 160 g, and 160 s may be about the same as the width/spacing W₁ between adjacent word lines WL_(x) and WL_(x+1) shown in FIGS. 3A-B. A width/spacing of a gap remaining between portions of the sacrificial mask layer 162 on adjacent even word line mask patterns 160 w may be about the same as a width F₁ of an odd word line WL₁, WL₃, . . . WL_(2n−1) shown in FIGS. 3A-B.

After forming the sacrificial mask layer 162, a second hard mask layer 164 may be formed on the sacrificial mask layer 162, as further shown in FIG. 6B. Moreover, the second hard mask layer 164 may be a layer of silicon oxide, and the second hard mask layer 164 may have a thickness that is at least one half of the width F₁ to thereby fill gaps in the sacrificial mask layer 162 between odd word line hard mask patterns 160 w. Because wider gaps are provided between adjacent ground select line hard mask patterns 160 g and between adjacent string select line hard mask patterns 160 s, however, gaps 168 may remain in the second hard mask layer 164. If a thickness of the second hard mask layer 164 is about the width F₁ of a word line, adjacent ground select line patterns 160 g and adjacent string select line patterns 160 s may be separated by a width/spacing greater than four times F₁.

The second hard mask layer 164 may then be subjected to an etch back operation to remove portions of the hard mask layer 164 from between adjacent ground select line hard mask patterns 160 g, from between adjacent string select line hard mask patterns 160 s, and from upper surfaces of the sacrificial mask layer 162, as shown in FIG. 6C. Portions of the second hard mask layer 164 remaining after the etch back operation may thus have about the thickness F₁. More particularly, portions of the second hard mask layer 164 remaining after the etch back operation may define a second hard mask pattern 170 on the sacrificial mask layer 162. The second hard mask pattern 170 may include odd word line patterns 170 w between adjacent even word line patterns 160 w and between the last odd word line pattern 160 w and the string select line pattern 160 s.

Exposed portions of the sacrificial mask layer 162 may then be removed (for example, using a dry etch) as shown in FIG. 6D to expose portions of the etch target layer 152 not covered by the first and/or second hard mask patterns 160 and/or 170. Exposed portions of the etch target layer 152 may then be removed (for example, using a dry etch) using the first and second hard mask patterns 160 and 170 as an etch mask, and the first and second hard mask patterns 160 and 170 may then be removed to provide the structure of FIGS. 3A-B.

FIG. 4A is a plan view of a non-volatile memory device 40 (such as a flash memory device) according to some embodiments of the present invention, and FIG. 4B is a cross-sectional view taken along section line IV-IV′ of FIG. 4A. The flash memory device 40 may include a plurality of parallel active regions ACT in a semiconductor substrate SUB separated by device isolation layers. In addition, ground select lines GSL₀₋₂, string select lines SSL₀₋₂, and memory cell word lines WL_(1-2n) (where n is an integer) may cross the active regions ACT. More particularly, a respective charge storage gate may be provided between each memory cell word line WL_(1-2n) and each active region ACT to provide a respective memory cell at each intersection of a memory cell word line WL_(1-2n) and an active region ACT. The structure of FIGS. 4A-B is similar to that of FIGS. 2A-B with the omission of dummy word lines.

An even number of memory cell word lines WL_(1-2n) along an active region ACT between a ground select line GSL and a string select line SSL (e.g., between GSL₁ and SSL₁) may define a memory cell string including an even number of memory cells. As further shown in FIGS. 4A-B, adjacent memory cell strings may be separated by two ground select lines GSL (e.g., GSL₀ and GSL₁) or by two string select lines SSL (e.g., SSL₁ and SSL₂). More particularly, 2^(k) (where k is a positive integer) memory cell word lines WL_(1-2n) may define a memory cell string including 2^(k) memory cells used to store data.

Moreover, an order of memory cell word lines WL_(1-2n) of adjacent memory cell strings may have a mirror image symmetry. For example, an order of memory cell word lines WL_(1-2n) between ground select line GSL₀ and string select line SSL₀ may have mirror image symmetry relative to an order of memory cell word lines WL_(1-2n) between ground select line GSL₁ and string select line SSL₁. Similarly, an order of memory cell word lines WL_(1-2n) between ground select line GSL₁ and string select line SSL₁ may have mirror image symmetry relative to an order of memory cell word lines WL_(1-2n) between ground select line GSL₂ and string select line SSL₂. By providing a sufficient spacing/width WL₄ between a ground select line GSL and a first memory cell word line WL₁ of a memory cell string, a ground induced leakage current and/or an erase disturbance at the first memory cell word line WL₁ may be reduced.

A controller of the non-volatile memory device may be coupled to the ground select lines, the string select lines, and the memory cell word lines. During an erase operation, for example, the controller may be configured to allow the ground select line GSL₁ to float, to apply an erase voltage Vers of about 20 volts to a p-well of the substrate SUB, and to apply 0 volts to the memory cell word lines WL_(1-2n). During a write (or program) operation, the controller may be configured to apply the supply voltage Vcc to the ground select line GSL₁, to apply 0 volts to a p-well of the substrate SUB, to apply a pass voltage Vpass to the non-selected word lines, and to apply a program voltage Vpgm to the selected word line.

As shown in FIGS. 4A-B, each of the memory cell word lines WL₁ to WL_(2n) may have about a same width F₁, and a width/spacing W₅ may separate a gate selection line GSL and an adjacent first memory cell word line WL₁ of an associated memory cell string. About the same width/spacing W₁ may separate adjacent memory cell word lines WL_(x) and WL_(x+1), and about the same width/spacing W₁ may separate a last memory cell word line WL_(2n) and an adjacent string select line SSL. Moreover, the widths F₁ and W₁ may be about the same, and more particularly, each of the widths F₁ and W₁ may be about one fourth (¼) of a period P₁ defined by adjacent even memory cell word lines WL_(even) and WL_(even+2) (i.e., even memory cell word lines separated by only one odd memory cell word line), or defined by adjacent odd memory cell word lines WL_(odd) and WL_(odd+2) (i.e., odd memory cell word lines separated by only one even memory cell word line). As further shown in FIGS. 4A-B, adjacent ground selection lines GSL₀ and GSL₁ may be separated by about a width/spacing W₂, and adjacent string selection lines SSL₀ and SSL₁ may be separated by about the same width/spacing W₂. The spacing/width W₂ may be at least about 3 times greater than the spacing/width W₁. Moreover, the spacing/width W₅ may be greater than about three times the spacing/width W₁ (i.e., W₅>3X W₁). For example, the second and/or fifth spacings W₂ and/or W₅ may be between about 3 and 4 times greater than the first spacing W₁, or the second and/or fifth spacing W₂ and/or W₅ may be more than 3 times greater than the first spacing W₁, and still more particularly, more than 4 times greater than the first spacing W₁.

Each memory cell word line WL₁ to WL_(2n) may thus provide a respective control electrode for a non-volatile memory cell (such as a flash memory cell) of a memory cell string on a same active region ACT between a ground select line (e.g., GSL₁) and a string select line (e.g., SSL₁). Each non-volatile memory cell may also include a charge storage layer between the respective memory cell word line and active region, a tunnel insulating layer between the active region and the charge storage layer, and a barrier insulating layer between the memory cell word line and the charge storage layer.

The pattern of ground select lines GSL, memory cell word lines WL₁ to WL_(2n), and string select lines SSL may be formed using self-aligned double patterning as discussed in greater detail below. For example, the ground select lines GSL, the string select lines SSL, and the odd memory cell word lines (WL₁, WL₃, WL₅ . . . WL_(2n−1)) may be formed corresponding to a pattern of a photolithography mask, and even memory cell word lines (WL₂, WL₄, WL₆ . . . WL_(2n)) may be formed using self-aligned double patterning.

According to some embodiments of the present invention illustrated in FIGS. 4A-B, a first memory cell string on the active region ACT may include a first plurality of memory cell word lines WL₁ to WL_(2n) crossing the active region ACT between the first ground select line GSL₁ and the first string select line SSL₁, and about a same first spacing W₁ may be provided between adjacent ones of the first plurality of word lines. In addition, a second memory cell string on the active region ACT may include a second plurality of word lines WL₁ to WL_(2n) crossing the active region ACT between a second ground select line GSL₀ and a second string select line SSL₀, and about the same first spacing W₁ may be provided between adjacent ones of the second plurality of word lines. More particularly, the first ground select line GSL₁ may be between the second ground select line GSL₀ and the first plurality of word lines, and the second ground select line GSL₀ may be between the first ground select line GSL₁ and the second plurality of word lines. Moreover, portions of the active region ACT between the first and second ground select lines GSL₁ and GSL₀ may be free of word lines, and the second spacing W₂ between the first and second ground select lines GSL₁ and GSL₀ may be at least about 3 times greater than the first spacing W₁. For example, the second spacing W₂ may be between about 3 and 4 times greater than the first spacing W₁, and more particularly, the second spacing W₂ may be about 3 times greater than the first spacing W₁.

As further shown in FIGS. 4A-B, the first plurality of word lines WL₁ to WL_(2n) may include an even number of memory cell word lines, and a spacing/width W₅ greater than 3 times the first spacing W₁ may be provided between the ground select line GSL₁ and the first memory cell word line WL₁ of the respective memory cell string. Moreover, about the first spacing/width WL₁ may be provided between the last memory cell word line WL_(2n) of the respective memory cell string and the string select line SSL₁, and portions of the active region ACT between the ground select line GSL₁ and the first memory cell word line WL₁ may be free of word lines.

FIGS. 7A-D are cross-sectional views illustrating operations of forming the non-volatile memory structures of FIGS. 4A-B using self-aligned double patterning according to some embodiments of the present invention. As shown in FIG. 7A, a substrate 350 may include an etch target layer 352 thereon, and the etch target layer 352 may include layers of materials used to form the memory cells, word lines, selection transistors, and selection lines of FIGS. 4A-B.

More particularly, the target layer may include a tunnel insulating layer (such as a layer of silicon oxide), a charge storage gate layer (such as a layer of polysilicon or silicon nitride), a barrier insulating layer (such as a layer of silicon oxide or other dielectric material different than the charge storage gate layer), and conductive layer (such as a layer of polysilicon and/or metal). The charge storage layer may be between the conductive layer and the substrate with the tunnel insulating layer separating the charge storage layer and the substrate and with the barrier insulating layer separating the charge storage layer and the conductive layer. In addition, a first hard mask layer 355 may be formed on the etch target layer 352, and the first hard mask layer 355 may include a silicon nitride layer 356 on a pad oxide layer 354.

A photoresist layer on the first hard mask layer 355 may be patterned using the photo-mask 300 to provide the photoresist pattern 358 including odd word line photoresist patterns 358 w, ground select line photoresist patterns 358 g, and string select line photoresist patterns 358 s. More particularly, the photo-mask 300 may include a photo-mask pattern 304 on a transparent substrate 302. The photo-mask pattern 304 may include odd word line photo-mask patterns 304 w corresponding to odd word line photoresist patterns 358 w, ground select line photo-mask patterns 304 g corresponding to ground select line photoresist patterns 358 g, and string select line photo-mask patterns 304 s corresponding to string select line photoresist patterns 358 s.

As further shown in FIG. 7A, adjacent odd word line photo-mask patterns 304 w may be spaced apart by about a width/spacing W₁₁, and adjacent odd word line photoresist patterns 358 w may be spaced apart by about the width/spacing W₁₁. A first of the odd word line photo-mask patterns 304 w may be spaced apart from an adjacent ground select line photo-mask pattern 304 g by about a width/spacing W₅, and a last of the odd word line photo-mask patterns 304 w may be spaced apart from an adjacent string select line photo-mask pattern 304 s by about the width/spacing W₁₁. Similarly, a first of the odd word line photoresist patterns 358 w may be spaced apart from an adjacent ground select line photoresist pattern 358 g by about the width/spacing W₅, and a last of the odd word line photo-mask patterns 358 w may be spaced apart from an adjacent string select line photo-mask pattern 358 s by about the width/spacing W₁₁.

Moreover, each of the odd word line photo-mask patterns 304 w and each of the odd word line photoresist patterns 358 w may have a width of about F₁, and the width/spacing W₁₁ may be about three times the width F₁. In addition, adjacent ones of the odd word line photo-mask patterns 304 w and adjacent ones of the odd word line photoresist patterns 358 w may define a period P₁, and the period P₁ may be about 4 times the width F₁. The width F₁ may be a minimum feature size available from the photolithography technology being used. Adjacent ground select line photo-mask patterns 304 g, adjacent string select line photo-mask patterns 304 s, adjacent ground select line photoresist patterns 358 g, and adjacent string select line photoresist patterns 358 s may be separated by a width/spacing W₂, and the width/spacing W₂ may be greater than three times the width F₁. For example, the second spacing W₂ may be between about 3 and 4 times greater than the first spacing W₁, or the second spacing W₂ may be more than 3 times greater than the first spacing W₁, and still more particularly, more than 4 times greater than the first spacing W₁.

In addition, a spacing/width W₅ between a first odd word line photo-mask pattern 304 w and an adjacent ground select line photo-mask pattern 304 g and between a first odd word line photoresist pattern 358 w and an adjacent ground select line photoresist pattern 358 g may be greater than W₁₁ (e.g., greater than three times the width F₁). For example, the spacing/width W₅ may be greater than four times F₁.

More particularly, a continuous photoresist layer may be selectively exposed to radiation through the photomask 300 and then developed to provide the photoresist pattern 358 of FIG. 7A. Accordingly, an arrangement of the photoresist pattern 358 is defined by an arrangement of the photo-mask pattern 304. In addition, the photoresist pattern 358 corresponds to a pattern of gate select lines, string select lines, and odd word lines discussed above with respect to FIGS. 4A-B.

Portions of the first hard mask layer 355 (including silicon nitride layer 356 and pad oxide layer 354) exposed by the photoresist pattern 358 may be selectively removed (for example, using dry etching) to provide a first hard mask pattern 360 (including ground select line hard mask patterns 360 g, string select line hard mask patterns 360 s, and odd word line hard mask patterns 360 w) as shown in FIG. 7B. If the first hard mask layer 355 includes separate layers 354 and 356, each element of the first hard mask pattern 360 may also include separate layers 354 and 356. About the spacing/width W₅ (greater than W₁₁) may be provided between a ground select line hard mask pattern 360 g and a first odd word line hard mask pattern 360 w. About the same spacing/width W₁₁ may be provided between adjacent odd word line hard mask patterns 360 w, and between a last odd word line hard mask pattern 360 w and a string select line hard mask pattern 360 s. Each element of the first hard mask pattern 360 may include a layer of silicon nitride and/or silicon oxide. After selectively removing portions of the first hard mask layer, the photoresist pattern 358 may be removed.

As further shown in FIG. 7B, a sacrificial mask layer 362 may be formed on the first hard mask pattern 360 and on portions of the etch target layer 352 exposed by the first hard mask pattern 360, and the sacrificial mask layer 362 and the first hard mask pattern 360 may comprise different materials. For example, upper layers 356 of the first hard mask pattern 360 may be a layer of silicon nitride, and the sacrificial mask layer 362 may be a layer of polysilicon. Moreover, a thickness of the sacrificial mask layer 362 may be provided so that: gaps remain between portions of the sacrificial mask layer 362 on sidewalls of adjacent ones of the odd word line hard mask patterns 360 w; gaps remain between portions of the sacrificial mask layer 362 on sidewalls of adjacent ground select line hard mask patterns 360 g; gaps remain between portions of the sacrificial mask layer 362 on sidewalls of adjacent string select line hard mask patterns 360 s; gaps remain between portions of the sacrificial mask layer 362 on sidewalls of adjacent select line hard mask patterns 360 g and first odd word line hard mask patterns 360 w; and gaps remain between portions of the sacrificial mask layer 362 on sidewalls of adjacent select line hard mask patterns 360 s and last odd word line hard mask patterns 360 w.

A thickness of the sacrificial mask layer 362 on sidewalls of the first hard mask patterns 360 w, 360 g, and 360 s may be about the same as the width/spacing W₁ between adjacent word lines WL_(x) and WL_(x+1) shown in FIGS. 4A-B. A width of a gap remaining between portions of the sacrificial mask layer 362 on adjacent odd word line mask patterns 360W may be about the same as a width F₁ of an even word line WL₂, WL₄, . . . WL_(2n) shown in FIGS. 4A-B.

After forming the sacrificial mask layer 362, a second hard mask layer 364 may be formed on the sacrificial mask layer 362, as further shown in FIG. 7B. Moreover, the second hard mask layer 364 may be a layer of silicon oxide, and the second hard mask layer 364 may have a thickness that is at least one half of the width F₁ to thereby fill gaps in the sacrificial mask layer 362 between odd word line hard mask patterns 360 w. Because wider gaps are provided between adjacent ground select line hard mask patterns 360 g, between adjacent string select line hard mask patterns 360 s, and between ground select line hard mask patterns 360 g and adjacent first odd word line hard mask patterns 360 w, however, gaps 368 may remain in the second hard mask layer 364. If a thickness of the second hard mask layer 364 is about the width F₁ of a word line, adjacent ground select line patterns 360 g, adjacent string select line patterns 360 s, and ground select line hard mask patterns 360 g and adjacent first odd word line hard mask patterns 360 w may be separated by a width/spacing greater than four times F₁.

The second hard mask layer 364 may then be subjected to an etch back operation to remove portions of the hard mask layer 364 from between adjacent ground select line hard mask patterns 360 g, from between adjacent string select line hard mask patterns 360 s, from between ground select line hard mask patterns 360 g and adjacent first odd word line hard mask patterns 360 w, and from upper surfaces of the sacrificial mask layer 362, as shown in FIG. 7C. Portions of the second hard mask layer 364 remaining after the etch back operation may thus have about the thickness F₁. More particularly, portions of the second hard mask layer 364 remaining after the etch back operation may define a second hard mask pattern 370 on the sacrificial mask layer 362. The second hard mask pattern 370 may include even word line patterns 370 w between adjacent odd word line patterns 360 w and between the last odd word line patterns 360 w and the adjacent string select line pattern 360 s.

Exposed portions of the sacrificial mask layer 362 may then be removed (for example, using a dry etch) as shown in FIG. 7D to expose portions of the etch target layer 352 not covered by the first and/or second hard mask patterns 360 and/or 370. Exposed portions of the etch target layer 352 may then be removed (for example, using a dry etch) using the first and second hard mask patterns 360 and 370 as an etch mask, and the first and second hard mask patterns 360 and 370 may then be removed to provide the structure of FIGS. 4A-B.

According to embodiments of the present invention, NAND-type nonvolatile memory devices may be provided having structures with dimensions smaller than dimensions that may be available using one photolithographic exposure followed by one etch. Accordingly, NAND-type nonvolatile memory devices having relatively fine line and space patterns (such as patterns of word lines) may be provided, and increased integration density and/or increased performance may result.

While the present invention has been particularly shown and described with reference to embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims. 

1-28. (canceled)
 28. A method of forming a non-volatile memory device, the method comprising: forming an etch target layer on a substrate; forming first hard mask patterns including a plurality of odd word line patterns between first and second select line patterns, wherein about a same spacing is provided between the first select line pattern and a first odd word line pattern, between adjacent odd word line patterns, and between a last odd word line pattern and the second select line pattern, wherein the first hard mask pattern comprises a first material; forming a sacrificial mask layer on the first hard mask pattern, wherein gaps remain between portions of the sacrificial mask layer on sidewalls of adjacent ones of the odd word line patterns, wherein the sacrificial mask layer comprises a second material, and wherein the first and second materials have different compositions; forming second hard mask patterns on the sacrificial mask layer, wherein the second hard mask patterns includes a dummy word line pattern between the first select line pattern and the first odd word line pattern and includes even word line patterns between adjacent odd word line patterns and between the last odd word line pattern and the second select line pattern, wherein the second hard mask pattern comprises a third material, and wherein the second and third materials have different compositions; removing portions of the sacrificial mask layer between the first and second hard mask patterns so that portions of the etch target layer are exposed between the first and second hard mask patterns; and etching portions of the etch target layer exposed between the first and second hard mask patterns.
 29. A method according to claim 28 wherein the spacing provided between the first select line pattern and the first odd word line pattern is about three times a width of the first odd word line pattern.
 30. A method according to claim 28 wherein the first hard mask patterns comprise silicon nitride, wherein the sacrificial mask layer comprises polysilicon, and wherein the second hard mask patterns comprise silicon oxide.
 31. A method according to claim 28 wherein the odd word line patterns have about a same width and wherein the spacing between adjacent ones of the plurality of the odd word line patterns is greater than the width of the odd word line patterns.
 32. A method according to claim 28 wherein forming the etch target layer comprises, forming a charge storage layer on the substrate, forming a barrier insulating layer on the charge storage layer, and forming a control gate layer on the barrier insulating layer.
 33. A method of forming a non-volatile memory device, the method comprising: forming an etch target layer on a substrate; forming first hard mask patterns on the substrate wherein the first hard mask patterns include a plurality of even word line patterns between first and second select line patterns and a dummy word line pattern between the first select line pattern and a first even word line pattern, wherein about a same first spacing is provided between the dummy word line pattern and the first even word line pattern and between adjacent even word line patterns, and wherein a second spacing is provided between the first select line pattern and the dummy word line pattern and between a last even word line pattern and the second select line pattern, wherein the second spacing is less than the first spacing, and wherein the first hard mask patterns comprise a first material; forming a sacrificial mask layer on the first hard mask patterns wherein gaps remain between portions of the sacrificial mask layer on sidewalls of adjacent ones of the even word line patterns and between the dummy word line pattern and the first even word line pattern, wherein the sacrificial mask layer comprises a second material, and wherein the first and second materials have different compositions; forming second hard mask patterns in the gaps on the sacrificial layer wherein the second hard mask patterns comprise odd word-line patterns between adjacent even word line patterns and between the dummy word line pattern and the first even word line pattern, wherein the second hard mask patterns comprise a third material, wherein the second and third materials have different compositions; removing portions of the sacrificial mask layer between the first and second hard mask patterns so that portions of the etch target layer are exposed between the first and second hard mask patterns, wherein a space between the dummy word line pattern and the first select line pattern is free of any of the second hard mask patterns; and etching portions of the etch target layer exposed between the first and second hard mask patterns.
 34. A method according to claim 33 wherein the first spacing provided between the dummy word line pattern and a first even word line pattern and between adjacent even word line patterns is about three times a width of the first even word line pattern.
 35. A method according to claim 34 wherein the second spacing is greater than a width of the first even word line pattern and no greater than two times the width of the first even word line pattern.
 36. A method according to claim 33 wherein the second spacing is in the range of about 1.5 times the width of the first even word line pattern to about 2 times the width of the first even word line pattern.
 37. A method according to claim 33 wherein the even word line patterns have about a same width and wherein the spacing between adjacent ones of the plurality of the even word line patterns is greater than the width of the even word line patterns.
 38. A method according to claim 33 wherein forming the etch target layer comprises, forming a charge storage layer on the substrate, forming a barrier insulating layer on the charge storage layer, and forming a control gate layer on the barrier insulating layer.
 39. A method of forming a non-volatile memory device, the method comprising: forming an etch target layer on a substrate; forming first hard mask patterns on the substrate, wherein the first hard mask patterns include a plurality of odd word line patterns between first and second select line patterns, wherein about a same first spacing is provided between adjacent odd word line patterns and between a last odd word line pattern and the second select line pattern, and wherein a second spacing is provided between the first select line pattern and a first odd word line pattern, wherein the second spacing is greater than the first spacing, and wherein the first hard mask patterns comprise a first material; forming a sacrificial mask layer on the first hard mask patterns, wherein gaps remain between portions of the sacrificial mask layer on sidewalls of adjacent first hard mask patterns wherein the sacrificial mask layer comprises a second material, and wherein the first and second materials have different compositions; forming second hard mask patterns on the sacrificial layer wherein the second hard mask patterns include even word line patterns between adjacent odd word line patterns and between the last odd word line pattern and the second select line pattern, wherein a space between the first select line pattern and the first odd word line pattern is free of any of the second hard mask patterns, wherein the second hard mask patterns comprise a third material, and wherein the second and third materials have different compositions; removing portions of the sacrificial mask layer between the first and second hard mask patterns so that portions of the etch target layer are exposed between the first and second hard mask patterns; and etching portions of the etch target layer exposed between the first and second hard mask patterns.
 40. A method according to claim 39 wherein the same first spacing is about three times a width of the first odd word line pattern.
 41. A method according to claim 39 wherein forming the etch target layer comprises, forming a charge storage layer on the substrate, forming a barrier insulating layer on the charge storage layer, and forming a control gate layer on the barrier insulating layer. 